Join us for the 2024 IEEE International Conference on High Voltage Engineering and Application in Berlin, Germany!
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We are thrilled to invite you to the 2024 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2024), organized by Technische Universität Berlin, Germany and endorsed by IEEE Dielectrics and Electrical Insulation Society.
Join us in Berlin, Germany, from August 18-22, 2024 for a week of sparking discussions, cutting-edge research and networking opportunities with the brightest minds in the field.
Extension of Full Paper Submission Deadline
We are pleased to inform you that the deadline for full paper submissions has been extended to April 30th. We hope that this extension will provide you with the additional time needed to refine and finalize your submissions.
Thank you for your dedication and contributions. We look forward to receiving your papers.
Thank you for your dedication and contributions. We look forward to receiving your papers.
IEEE DEIS Award Nominations
IEEE DEIS is now accepting nominations for the prestigious IEEE Caixin Sun and Stan Grzybowski Awards! If you know a brilliant mind in high-voltage engineering who deserves recognition, this is your moment.
- Young-Professional Achievement Award - Celebrating early-career professionals (3-10 years post-bachelor's) who are changing the game in high-voltage engineering.
- Lifetime Achievement Award - Honoring the legends with at least 20 years of transformative contributions to the field.
VISA invitation letter now available!
Dear International Participants,
We are pleased to inform you that the visa invitation letter is now available for download via ConfTool. Please log in to your account at your earliest convenience to access the document.
Should you require any further assistance, feel free to contact us.
Update (08. Mar 2024): The VISA invitation letter has been revised. Please download the new version if you haven't done so already. Sorry for the inconvenience.
We are pleased to inform you that the visa invitation letter is now available for download via ConfTool. Please log in to your account at your earliest convenience to access the document.
Should you require any further assistance, feel free to contact us.
Update (08. Mar 2024): The VISA invitation letter has been revised. Please download the new version if you haven't done so already. Sorry for the inconvenience.
Abstract Acceptance Announcements This Week!
The moment you've all been waiting for is almost here. Decisions on abstract acceptances will be announced this week! Keep an eye on your inbox and our website. Thank your for your patience!
Abstract Submission Deadline Extended
In response to numerous requests, we're excited to announce that the abstract submission deadline is now extended by two weeks. This extension is our commitment to fostering inclusive participation from across the globe.
New Abstract Submission Deadline: February 15, 2024
New Abstract Submission Deadline: February 15, 2024
Call for Papers ICHVE 2024 - Inspiring Innovation in High Voltage Engineering
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It is with great enthusiasm that we extend a warm invitation for your active participation in the 2024 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2024). This premier event is set to take place at Technische Universität Berlin, Germany from August 18 to 23, 2024. We are looking forward to your paper submission.
Call for Papers and Abstract Deadline Announced
The International Conference on High Voltage Engineering and Application (ICHVE 2024) is set to take place in Berlin, Germany from August 18-23, 2024. The conference organizers have announced that paper abstract submissions will be available starting December 18, 2023. Researchers and professionals in the field of high-voltage engineering are encouraged to submit their abstracts by the deadline of January 31, 2024.
Application successful
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The Technische Universität Berlin (TU Berlin) has successfully applied to host the IEEE International Conference for High Voltage Engineering and Application 2024, sponsored bei the Dielectrics and Electric Insulation Society (DEIS). This will be the eighth installment of this conference series. The organization process is in full swing and new updates will be posted here.